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New ClassOne chamber cuts copper plating costs 95%

04/20/2017  ClassOne Technology announced it's new CopperMax chamber -- a design that is demonstrating major copper plating cost reductions for users of ?200mm wafers.

Gartner reports worldwide PC shipments declined 2.4% in first quarter of 2017

04/19/2017  Worldwide PC shipments totaled 62.2 million units in the first quarter of 2017, a 2.4 percent decline from the first quarter of 2016, according to preliminary results by Gartner, Inc.

Brewer Science earns GreenCircle Certification for zero waste to landfill for second consecutive year

04/19/2017  Brewer Science announced the achievement of Zero Waste to Landfill Certification for the second consecutive year.

Graphene 'copy machine' may produce cheap semiconductor wafers

04/19/2017  Engineers use graphene as a 'copy machine' to produce cheaper semiconductor wafers.

3D-Micromac receives large volume orders from solar industry for its microCELL TLS system

04/18/2017  3D-Micromac AG today announced that the total received order volume for its microCELL TLS high-throughput half-cell cutting tools tops 1.5 GW for tool deliveries in 2017 to date.

InvenSense receives regulatory clearances

04/18/2017  InvenSense, Inc., a provider of MEMS sensor platforms, today announced that all necessary regulatory clearances have been received for the acquisition by TDK Corporation of InvenSense.

NREL researchers capture excess photon energy to produce solar fuels

04/18/2017  Scientists at the U.S. Department of Energy's National Renewable Energy Laboratory (NREL) have developed a proof-of-principle photoelectrochemical cell capable of capturing excess photon energy normally lost to generating heat.

Global ESD packaging market driven by the miniaturization of semiconductors, says Technavio

04/17/2017  According to the latest market study released by Technavio, the electrostatic discharge (ESD) packaging market is projected to grow to USD 5.42 billion by 2021, at a CAGR of more than 8% over the forecast period.

3D-Micromac launches the second generation of its high-performance microcell OTF laser systems

04/17/2017  The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a throughput of 8,000 wafers per hour.

Columbia engineers invent method to control light propagation in waveguides

04/17/2017  New technique using nano-antennas to make photonic integrated devices smaller with a broader working wavelength range could transform optical communications.

SEMICON Southeast Asia 2017: Disruption and the value of digital transformation in manufacturing

04/17/2017  At SEMICON Southeast Asia 2017, Dr. Chen Fusen, CEO of Kulicke & Soffa Pte Ltd, Singapore, will give a keynote on digital transformation in the manufacturing sector.

GaN Systems' investors receive Venture Capital Awards

04/17/2017  Investor of the Year, Chrysalix Venture Capital selected over 11,000 nominees Cycle Capital Management named Canada's 2nd most active VC in 2016.

Axcelis announces multiple Purion orders from several leading chip makers in Asia Pacific

04/14/2017  Axcelis Technologies, Inc. announced today that it has received multiple orders for the Purion H high current, Purion XE high energy, and Purion EXE extended high energy system from several leading chip manufacturers in the Asia Pacific region.

New switching process in non-volatile spintronics devices

04/14/2017  Physicists achieved a robust and reliable magnetization switching process by domain wall displacement without any applied fields. The effect is observed in tiny asymmetric permalloy rings and may pave the way to extremely efficient new memory devices.

Kulicke & Soffa opens latest process and applications laboratory

04/13/2017  Kulicke & Soffa Industries, Inc. announced today the opening of its latest Process and Applications laboratory at the K&S Netherlands facility.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors

Development of Silicon Photonics Devices Discussed in Forum

07/09/2014  Six speakers discussed developments in designing and manufacturing silicon photonics devices in a TechXPOT North session on Wednesday morning.

The Connected Experience: A ManufacturerÂ’s Dream?

07/09/2014  Imagine being able to not only track and address equipment degradation in real time, but also analyze patterns in your factoriesÂ’ equipment and address potential issues before they even present a problem. It may sound too good to be true, but MicrosoftÂ’s Sanjay Ravi explained in Wednesday morningÂ’s keynote that this innovation is becoming available now to manufacturers.