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Growth Markets for Advanced Packages

06/01/2005  Summertime offers lots of opportunities to look at new markets, refocus on those in the past, and regroup in general.

All I Want Is An Off-the-shelf High-frequency Package

06/01/2005  More packages are being designed for high-speed, high-frequency chips, especially with the recent licensing of spectrums above 50 GHz.

Designers Turn to 3-D As Packages Mimic Manhattan Skyline

06/01/2005  oday’s designers continually strive to pack more functionality into smaller component footprints, and provide more end-customer value by reducing the effort and the risk inherent in designing new devices and technology.

New Aging Mechanism in Multilayer Ceramic Capacitators

06/01/2005  s IC progress drives more functionality onto each IC die, fewer ICs on each PCB are required.

Materials Compatibility Enables Next-Gen Performance in Packaging

06/01/2005  Moore’s Law has taken us from microelectronics to nanoelectronics. The need to stay on the materials treadmill has never been greater.

Automotive Packaging Is a Powerful, Problem-solving Tool

06/01/2005  Protecting Silicon From Extreme Environments

Enhancing Flip Chip Reliability

06/01/2005  THE FLUX UNDERFILL INTERFACE

X-Ray Analysis: Improving Inspection Quality

06/01/2005  NEW TECHNOLOGY QUICKLY IDENTIFIES FAULTS

Optimizing Underfill Materials and Processes

06/01/2005  High-volume Assembly Of Lead-free Area Array Packages

Allen Institute for Brain Science benefits from Millipore's ultrapure water systems

05/31/2005  Billerica, Massachusetts --- May 31, 2005 --- The Allen Institute for Brain Science (AIBS) is approximately halfway through completing the Allen Brain Atlas, a neurogenomics atlas of the mouse brain with cellular resolution.

VLSI: Global tool orders off in April

05/31/2005  Worldwide bookings for semiconductor manufacturing equipment totaled $3.72 billion in April, down 10.6% from March and 34.6% from a year ago, according to VLSI Research Inc.

Heard at Europa: ITRS stewards seek clarity, consensus for Roadmap priorities

05/31/2005  By Paula Doe, Contributing Editor, WaferNews

Key issues under discussion for the 2005 edition of the International Technology Roadmap for Semiconductors include the introduction of 450mm wafers, the problem of improving critical dimension control, and clearer definitions for half pitch to keep everybody honest, said regional committee chairmen in a press conference at the recent SEMICON Europa.

April Global Semiconductor Sales Slightly Lose Pace

05/31/2005  (May 31, 2005) San Jose, Calif. — Worldwide semiconductor sales declined slightly in April to $18.2 billion, 1.2% from $18.4 billion in March, reports the Semiconductor Industry Association (SIA). However, April sales were up 6.9% from $17.0 billion in April 2004, and the SIA notes that April is typically a strong month for semiconductor sales.

Global semiconductor sales show slight decline in April

05/31/2005  May 31, 2005 - Worldwide sales of semiconductors declined slightly in April to $18.2 billion, a sequential decline of 1.2% from the $18.4 billion reported in March, the Semiconductor Industry Association (SIA) reported today. April sales were up 6.9% from the $17.0 billion reported in April 2004. The SIA noted that April is traditionally a strong month for semiconductor sales.

AIXTRON delivers additional MOCVD system to Taiwan company

05/31/2005  May 31, 2005 - AIXTRON AG today announced the delivery of an additional Thomas Swan MOCVD system for the mass production of gallium nitride (GaN)-based ultra high brightness LED wafers and chips to Genesis Photonics Inc., Taiwan.

Of boys and ducks, odd ducks and quantum ducks

05/31/2005  He doesn't walk like a duck. Instead his scurrying across the screen suggests a fiddler crab, or a lobster, or a cockroach maybe. Nor does he quack like a duck, not one peep. Not when he paddles down a stream in his "Stuck with the Duck" scene, or when he bangs into furniture in the Funhouse, or when he does a 360 in a boat or bumper car. But he can bellow, as the "Aaaaargh" he lets out as he falls through a trap door in the Murky Mansion proves.

Tool companies collaborate on AFM tip development

05/31/2005  Veeco, a developer of atomic force microscopy (AFM) products, announced last week that it signed a joint development program with CEA Leti, an applied research electronics laboratory in Europe, and Team Nanotec, a fabricator of AFM probe tips.

ASHP 2005 Summer Meeting

05/27/2005  BOSTON, Mass.--The American Society of Health-System Pharmacists (ASHP) will be holding its 2005 Summer Meeting at the Boston Convention & Exhibition Center in Boston, June 11-15, 2005.

Spectra-Physics Becomes ISO 9001:2000-certified

05/27/2005  (May 27, 2005) Tucson, Ariz. — Spectra-Physics, a division of Newport Corp., announces that its Tucson, Ariz. facility has been awarded ISO 9001:2000 certification by RWTUV. The Tucson facility is responsible for the design and manufacture of all of the company's Prolite diode laser solutions, including single emitters, diode laser bars, and multi-bar modules (stacks).