FEB. 12 Singapore–ST Assembly Test Services (STATS) today announced that it has expanded its gallium arsenide (GaAs) capability to support package assembly for ICs on pre-sawn wafers down to a market-leading 4 mils thick.

As emerging communication applications push frequencies higher, GaAs technology offers many advantages, including lower power dissipation, excellent linearity, and a smaller chip size. With the ability to operate at faster speeds than silicon of the same geometry, GaAs devices offer a high-performance solution for communications market segments such as Gigabit Ethernet, ATM, SONET, and RF handsets.

Previously, STATS had positioned itself as a leader in GaAS handling by offering mechanical backgrinding and wafer saw devices, mechanical backgrinding with full assembly, and assembly on thinned wafers to customers.

“The growing demand for high-speed, high-performance devices is the driving force for GaAs technology,” says Lee Hoong Leong, vice president of Leaded Operations. “We are pleased to be able to support advanced technology applications that keep our customers on the cutting edge.”

To address the handling challenges associated with supporting GaAs semiconductor material, STATS has refined the wafer handling procedures and processes on its state-of-the-art silicon manufacturing equipment. STATS’ GaAs assembly area includes a separate sludge and wastewater management system for backgrind and saw equipment.