MUNICH, Germany—May 18, 2000—Karl Suss and Image Technology are teaming to develop standardized 9-inch photomasks for high volume wafer bumping and wafer-lever chip scale packaging.
By Stephanie Levy
MUNICH, Germany—May 18, 2000—Karl Suss and Image Technology are teaming to develop standardized 9-inch photomasks for high volume wafer bumping and wafer-lever chip scale packaging.
By Stephanie Levy
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