Micron breaks ground on Singapore testing facility

Boise, Idaho–Nov. 15, 2000–The groundbreaking for a new Micron Technology, Inc. assembly and test facility gets underway today in Singapore at the Tampines Industrial Cresent.

The 400,000-square-ft facility, which will house package assembly, testing, and module assembly, is scheduled for completion by early 2002.

“The success of our current Singapore operation, as well as the business-friendly environment, efficient infrastructure, and a well-trained workforce were all factors in our decision to expand,” says Jen Kwong Hwa, managing director of Micron Semiconductor Asia Pte. Ltd.

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