Dai Nippon Printing, Hoya team up on mask blank development

Aug. 8, 2002 – Tokyo, Japan – Dai Nippon Printing Co. and Hoya Corp. have penned a cooperative agreement in the field of mask blanks.

Under the new partnership, the two companies will collaborate to develop a mask blank for photomasks that can be used with new light-source steppers to define circuit patterns narrower than 100nm on wafers for next-generation semiconductor devices, reported the Nihon Keizai Shimbun.

Additionally, Dai Nippon Printing will cease production of mask blanks and procure the material from Hoya.

The companies did not reveal the financial details concerning Dai Nippon’s switch to the procurement of mask blanks from Hoya, but the two firms said they aim to complete development of their next-generation mask blank material by March of 2003.

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