Chaska, MN – The surface conditioning division of FSI International Inc. has joined The Dow Chemical Co.-sponsored SiLKnet Alliance to participate in the advancement of low-k surface conditioning solutions, for use in processing SiLK semiconductor dielectric resins.

Membership in the alliance will provide FSI with the opportunity to integrate its low-k cleaning capabilities into an end-to-end low-k solution. Collaboration among the SiLKnet Alliance members enables the development of proven, production-ready low-k products and processes that support the integration of SiLK in the 130-nm technology node and beyond.

“With the addition of FSI, the SiLKnet Alliance gains an established cleaning company. FSI brings nearly 30 years of experience and expertise in batch spray, and its proprietary CryoKinetic technology will expand the capabilities of the Alliance,” said Greg Bauer, development director for the SiLKnet Alliance.

Low-k and ultra low-k technology development is critical to advancement within the IC industry. The ITRS calls for the implementation of ultra low-k for production by 2005, which means that it must be in R&D by 2002. Involvement with the Alliance will allow FSI to play a key role in developing low-k and ultra-low-k technology through the enhancement of its BEOL cleaning solutions.

FSI will use its ZETA 300 BE Surface Conditioning Systems and ANTARES CX Advanced Cleaning Systems for the development work, as well as its lab facilities in Chaska for development and demonstration purposes. The development will focus on using the ZETA Systems for post-ash clean and resist strip, and using the ANTARES Systems for pre-deposition particle removal. FSI’s low-k clean capabilities have already been demonstrated in its process lab and at several customer sites.