July 12, 2005 – Aviza Technology, Inc. and the SEZ Group announced they are joining forces to solve key challenges surrounding ALD film removal for next-generation IC manufacturing.

Under a joint development agreement, both companies intend to leverage their expertise to develop solutions for deposition and removal of advanced films used in ALD applications, concentrating on the wafer backside and bevel edge.

“With the ever-increasing complexity of semiconductor devices, backside and bevel-edge film removal is playing an increasingly important role in the IC manufacturing process,” said Dr. Leo Archer, director of emerging technologies worldwide, SEZ. “Our collaboration with Aviza will be mutually rewarding, as we are both well positioned to address the intricacies of film deposition and removal at the sub-90-nm node.”

“The development of materials and processes for ALD applications is key to accelerating the ALD roadmap and driving the adoption of ALD,” said Jon Owyang, director of ALD product management at Aviza Technology. “Aviza is continually evaluating and developing advanced films to complement next-generation manufacturing processes.”