Winbond awards contract to ASML

May 18, 2005 – ASML Holding NV (ASML) today announced it was awarded a customer contract from Winbond Electronics Corp. to equip its 300mm fab in Taiwan. No financial details are being disclosed. ASML will install systems from its TWINSCAN platform starting next month.

Arthur Chiao, chairman of Winbond said,”Our goal is to use our new facility, Fab 6, to build on our leadership in mobile memory and specialty DRAM chips. ASML’s technology gives Winbond a competitive edge.”

“Through its new alliance with Winbond, ASML continues to gain share in the Taiwan memory market,” said Eric Meurice, president and CEO, ASML.

Taiwan is the fourth largest producer of semiconductors worldwide and home to a thriving memory chip market. Winbond and other major memory producers continue to invest in new lithography capacity within the country, ASML reported. Taiwan’s semiconductor industry achieved record sales of $35.4 billion in 2004, according to the Taiwanese government

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