July 21, 2004 – Amkor Technology Inc., Chandler, AZ, has agreed to acquire Unitive Inc., Research Triangle Park, NC, for $48 million, in addition to $23 million in bank debt. The deal covers equipment and facilities in the US and Taiwan, as well as IP and 250 employees.

Amkor also is purchasing 60% ownership in Taiwan-based Unitive Semiconductor Taiwan Corp., a joint venture between Unitive and various investors located in the Hsinchu Science Park near Amkor’s recently-acquired packaging/test facility, with an option to acquire the rest during the next 18 months for approximately $18 million.

With the deal Amkor gains technology and capacity for 300mm electroplated wafer bumping, lead-free wafer bumping and wafer level packaging, and bump/probe/assembly and test technology in Taiwan and the US.

Bruce Freyman, president and CEO, stated that purchasing the 300mm electroplated bump business provides it with an 18 month headstart in the market vs. building it internally, which would have depended on a license with Unitive anyway.

Amkor added that capital expenditures related to Unitive already are have been incorporated in its 2004 capex budget.