July 21, 2004 – Amkor Technology Inc. has signed definitive agreements to acquire privately-held Unitive Inc., based in North Carolina, and to obtain a majority interest of approximately 60% in Taiwan-based Unitive Semiconductor Taiwan Corp., a joint venture between Unitive and various Taiwanese investors.

With these acquisitions, Amkor gains technology for electroplated wafer bumping and turnkey wafer level “chip scale” packaging, together with installed and operationally qualified, high volume 200mm and 300mm electroplated wafer bumping and wafer level packaging manufacturing operations, according to company reports. Unitive develops “back-end” wafer level processing technologies including wafer level CSP, electroplated lead-free and low alpha wafer bumping, fine pitch solder bumps, redistribution, and multilayer thin-film capabilities.

In separate transactions, Amkor is acquiring Unitive and a 60% interest in UST. The combined cash purchase price is estimated at $48 million with the assumption of approximately $23 million of debt. The transactions are scheduled to close in August 2004, at which point Unitive and UST will become subsidiaries of Amkor.

The current Unitive and UST management teams in North Carolina and Taiwan will remain in place. The Unitive organization in North Carolina will continue to focus on development of advanced bumping and wafer level packaging technologies, which will be integrated into Amkor’s turnkey assembly and test solutions.