02/22/2019  GOWIN Semiconductor Corp. announces the release of GOWIN's new EDA tool, YunYuan 1.9.

01/25/2019  Laser systems specialist LPKF Laser & Electronics, based in Hannover, Germany has added a foundry service for thin glass substrates to its product portfolio.

11/19/2018  Toshiba Machine Co., Ltd. has developed the new DC-KT Series Die Casting Machines to meet the needs of the Southeast Asian market and has started sales and production at its plant in Thailand.

11/14/2018  MIRPHAB, a European Commission project to create a pilot line to fabricate mid-infrared (MIR) sensors by 2020, is accepting proposals from companies that want to develop and prototype new MIR devices that operate in gas-and-liquid media.

10/31/2018  Renesas Electronics Corporation today announced that it has resolved at the Meeting of Board of Directors held on October 31, 2018 to consolidate its wholly-owned subsidiary Renesas Semiconductor Package & Test Solutions Co, Ltd.

10/29/2018  Q3 sales are highest on record, 4.1 percent more than previous quarter, 13.8 percent higher than Q3 of last year.

10/24/2018  In the era of a slowing Moore's Law, advanced packaging has emerged as the savior of future semiconductor development.

10/19/2018  Technologies introduced at the event include 7nm LPP EUV, SmartSSD and 256GB 3DS RDIMM.

10/16/2018  High performance and stable all? Inorganic metal halide perovskite-based photodetectors for optical communication applications.

10/01/2018  AES will add ARM's gas purification technology to supplement and further expand its gas delivery equipment offerings.

09/27/2018  Alpha and Omega Semiconductor Limited today introduced the TO-Leadless (TOLL) package in combination with 40V Shield-Gate Technology (SGT) to provide the highest current capability in its voltage class.

09/26/2018  Driven by cryptocurrency device demand, TSMC's China sales are expected to surge by 79% this year.

08/31/2018  KLA-Tencor Corporation announced two new defect inspection products designed to address a wide variety of integrated circuit (IC) packaging challenges.