November 16, 2004 – Synopsys Inc. and KLA-Tencor announced that they are collaborating to develop a compact yield analysis and modeling system for Toshiba Corp. Toshiba will install the new modeling system at its 300-mm production facility in Oita, Japan, for use in both low- and high-volume system-on-chip manufacturing.
The new modeling system will enable Toshiba to improve parametric yields on its most advanced sub-100-nm system-on-chip products by predicting the impact of process variations on final device performance as they occur during large scale integration (LSI) production.
According to Toshiba, an important goal of this joint project is to enable improved information sharing between its IC design and process engineers in order to accelerate the company’s advanced process development and yield ramp efforts.