November 3, 2004 – Kulicke & Soffa Industries Inc. has signed an agreement to acquire a license for an innovative new device that makes temporary electrical connections to semiconductor chips. The company believes this special interconnection device will form the nucleus for the next generation of semiconductor sockets for its package test products.
David Beatson, VP and CTO of K&S, said that licensing this new interconnect technology will accomplish two engineering goals: reduce the time and cost to develop new test products and provide customers with technology that will lower their operating expenses for package testing.
Beatson expects the company will incorporate this device into new products within the next 18 to 24 months.