December 5, 2007 – EV Group (EVG) and Brewer Science say they have demonstrated temporary wafer bonding capabilities for a wide range of backside processes, including through-silicon vias (TSVs) and backside metallization, using an approach optimized for high-temperature advanced packaging applications.

Earlier this summer, the two companies announced that after more than a year of development work, they had successfully combined Brewer’s WaferBOND HT series of materials and EV Group’s 850TBDB bonding and debonding equipment platforms to perform temporary bonding of original-thickness device wafers (sub-100-micron) onto rigid carrier wafers (up to 300mm).

The combined technology platform addresses an industry need as it increases use of 3D stacking and wafer-level packaging approaches, including TSV, the companies said in a statement.

“Three-dimensional device stacking is essential to producing multifunctional devices with improved performance and compact footprints. High-temperature processing compatibility and fast debonding processing times of less than five minutes are important attributes to furthering the viable production capability of this innovative technology,” noted Jim Lamb, director of corporate business development with Brewer Science.