April 16, 2007 – Semprius Inc., a company developing transfer printing technology for manufacturing semiconductor devices, has closed a $4.1 million round of Series A venture funding, led by ARCH Venture Partners and Intersouth Partners, along with seed investor Illinois Ventures. Proceeds will be used for product and business development, the company said in a statement.

Semprius was spun out of the U. of Illinois in 2005 to commercialize technology that enables the placement of a high performance semiconductor onto any substrate or target wafer. The company claims the technology enables a manufacturing process that is faster and less expensive than alternatives, and can be applied to semiconductors, solar cells, and electronic displays. Initial applications of the technology include high frequency radio frequency semiconductors for mobile communications, TFT backplanes for flat panel displays and flexible digital X-ray detectors.