April 23, 2007 – Innovative Micro Technology has begun offering getter deposition services of wafer-level packaging (WLP) of MEMS devices and other components requiring a hard vacuum, saying it has demonstrated vacuum levels below 10 mTorr for inorganic devices, equal to or better than industry standard.

Vacuum is typically required for IR emission and sensing, resonant oscillators in biological or chemical applications, and other MEMS devices. The proprietary IMT getter is used for deposition on 150mm and smaller wafers in the company’s Class 100 clean room. Adding to IMT’s MEMS-manufacturing services is in response to an industry-wide demand in a range of wafer-level products, according to CEO John Foster.

The company offers shadow masking services along with getter deposition. Other MEMS processes at the 30,000-sq.ft facility include design and design-for-manufacture (DFM); prototyping; and bond, etch, and other production manufacturing services for fabless and fab-light companies.

(Courtesy of SST sister publication Advanced Packaging )