May 8, 2006 – SEMI has announced additional details about its backend technology-themed content pavilion at this year’s SEMICON West, developed in conjunction with leading industry associations and companies including FSA, the International Electronic Manufacturing Initiative (iNEMI), the Microelectronics Packaging and Test Engineering Council (MEPTEC), and TechSearch International.

The test, assembly, and packaging technologies “TechXPOT” will incorporate exhibits, displays, and exhibitor presentations, along with two detailed roadmap sessions, and presentations from select winners of the show’s fourth annual Technology Innovation Showcase (TIS) awards.

Sessions include test roadmaps and design for test, organized by SEMI; user packaging roadmaps, organized by MEPTEC; fabless roadmaps, organized by FSA; and a lead- free seminar, organized by iNEMI and TechSearch International.

The first of two sessions on test, assembly, and packaging technologies will address several topics, including “Drivers and Challenges for Packaging of Next Generation FPGAs,” an “ASICs Packaging Roadmap,” “Critical Package Requirements for Advanced Manufacturing Flow,” and “Mil-Aero Electronics.” A second session will cover “Modeling for Material Sets in Semiconductor Packaging Assembly,” the “Impact of Application Surface on the Development of TIMs,” “Electronic Packaging Materials,” and a “Global Semiconductor Packaging Materials Outlook led by SEMI’s Dan Tracy.

This year’s TiS winners for test, assembly, and packaging will also be on display and giving presentations in the TechXPOT. They include: Advanced Material Sciences Inc. (AMS), Aguila Technologies, Deep Photonics, ICOS Vision Systems, Microbonds Inc., Segin Semiconductor Solutions, Synova SA, and Xradia Inc.

SEMI test assembly packaging SEMICON West FPGA ASIC