October 19, 2011 — JSR Micro and CEA-Leti will partner to develop sub-20nm next-generation lithography materials and processes, focusing on pitch division in 193nm optical lithography for <20nm logic applications and on direct-write maskless lithography (ML2) technology.
The specific ML2 development will be part of the IMAGINE program, a three-year project led by CEA-Leti that also includes semiconductor manufacturers TSMC and STMicroelectronics. It is developing a maskless lithography infrastructure and the use of MAPPER Lithography tools for high throughput.
JSR will use its materials knowledge to improve performance, quality, and costs in this area, with the help of CEA-Leti’s "large and ambitious program," said Bruno Roland, president of JSR Micro.
Also read: Litho readiness for next-gen logic, flash, and DRAM
JSR Micro N.V. (Belgium), is a subsidiary of JSR Corporation, a multinational materials supplier to technology-driven markets: life-sciences, energy storage, electronic materials, display and optical materials.
Leti is an institute of CEA, a French research-and-technology organization with activities in energy, IT, healthcare, defence and security. For more information, visit www.leti.fr.