IEDM 2011 slideshow |
Graphene devices in a 200mm fab |
Hynix pushes NAND limits |
FinFETs for sub-20nm SoCs |
Mapping FinFET carrier profiles in 3D |
Hollow copper 3D TSVs |
Researchers from IBM demonstrate 200mm wafer-scale graphene devices — graphene FETs and RF passives — processed entirely in a standard silicon fab, billed as "a significant step toward moving graphene from an interesting curiosity into a manufacturable technology." Key to this work was building a gate dielectric on the inherently inert surface; to solve this, Si wafers were built with predefined embedded gate structures, upon which were transferred CVD-fabricated graphene layers.
The end result, a proof-of-concept frequency doubler, demonstrated ~25dB conversion gain at 2GHz, which was seen constant from 25-200