May 17, 2011 — Cost reduction, with increased performance and lower power consumption by the chip, are major trends for semiconductor manufacturing. The take-away for KLA-Tencor, says Brian Trafas, chief marketing officer, KLA-Tencor, is providing chip makers with process control to help with yield management. At The ConFab, KLA-Tencor is looking at future chip roadmaps to determine how they can support customer’s upcoming needs.
Trafas speaks with senior technical editor Debra Vogler this week at The ConFab 2011.
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High-growth markets, such as LEDs, have smaller bases, but still need inspection and metrology technologies. Products for substrate and pattern inspection have to interact with yield monitoring software to catch and correct defects.
For EUV lithography, KLAC is collaborating with customers and EUV-ecosystem companies to devise a strategy to monitor and define defects. Collaboration between tool suppliers, foundries, and other stakeholders are getting much tighter — a good sign, says Trafas.
More from the ConFab:
- Intel’s take on chip revenue growth, R&D spending, and design scaling
- Bring lithography <11nm with materials, not new steppers, says Brewer Science
- Customers, logic reshaping supplier collaboration landscape
- Connecting investments to industry trends
- Preparing, recovering from the Japan quake: One company’s response and plan
- Silicon Valley upstate: NY’s semiconductor manufacturing ambitions
- 2012 and onward for semiconductor fab managers
- 3D packaging disrupts the IC supply chain
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