November 30, 2011 — MicroTech has developed a wet process station to etch patterned sapphire substrate (PSS) wafers in a way that increases light-emitting diodes’ (LED) light output and efficiency while increasing manufacturing throughput.
In the MicroTech wet etch system, gallium nitride (GaN) or indium gallium nitride (InGaN) coated wafers are submerged in the etch tank with a mixture of etching and buffering agents. Prior to submersion, a silicon dioxide mask is patterned via plasma enhanced chemical vapor deposition (PECVD). A lithography step exposes the pattern to etch. The sapphire etch process takes place between 260
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