December 5, 2011 – Marketwire — Crossing Automation Inc., fab and tool automation product provider, introduced the Dynamic Access Recirculating Transport and Storage (DARTS) FOUP buffer to improve wafer movement and storage in IC manufacturing environments with high complexity and product mix.
The DARTS FOUP near-tool buffering system delivering benefits to both IC manufacturers and OEMs. It can be mounted under the ceiling, in a cleanroom bay aisle, or on top of a process tool.
"As manufacturing grows in complexity, process steps and product mix are increasing, and the number of FOUP moves is growing exponentially," said May Su, vice president, marketing for Crossing Automation. "The question becomes how to manage a fab under these conditions and increase productivity." Su notes the DARTS FOUP Buffer’s modular, easily configured design. For IC manufacturers, implementing the DARTS FOUP Buffer in strategic locations as a near-tool buffer can increase tool utilization by up to 30%. Fabs can also use the DARTS FOUP Buffer as an intra-bay mini-stocker.
Also read: Factors in determining COO for 300mm FOUPs
The integrated and proprietary Shuttle Lift FOUP hoist and gripper mechanism allows direct FOUP transfers between storage shelves and tool loadports independently from the OHT.
OEMs can maintain small tool footprints on high-throughput tools, using the FOUP as an alternative solution to larger EFEMs with additional loadports. It delivers configurable storage capacity and offers a cost-efficient solution for empty FOUP management.
Crossing has received multiple orders for its DARTS FOUP Buffer and the product is operating in a production environment.
To learn more about the DARTS FOUP Buffer, please visit Crossing Automation in the Hakuto Corporation booth, 6C-707, at SEMICON Japan in Chiba, December 7-9.
More SEMICON Japan product launches:
- EVG doubles process module space in XT Frame platform
- AMAT debuts SEM for automatic 20nm defect inspection
- Innolas makes 450mm wafer handling system
- Dainippon Screen develops maskless direct imaging exposure system
- Dainippon Screen single-wafer clean tool boasts 800 WPH
- ULVAC CVD-Co, -Ni system suits 3D gate, MEMS fab
- AMAT BSI image sensor CVD tool operates at low processing temps
Crossing Automation designs and manufactures fab and tool automation equipment for semiconductor device and equipment companies. For more information, visit http://www.crossinginc.com.