In a webcast scheduled for June 27th at 1:00 Eastern, 11:00 Pacific, David McCann of GLOBALFOUNDRIES will provide a status report on advanced packaging and 3D integration. McCann is responsible for Packaging R&D and back-end strategy and implementation at GLOBALFOUNDRIES. He will address what has recently changed, technology challenges, technology solutions, the “new” supply chain, and design for yield. He will describe the increasingly important role that foundries have played as the industry has evolved from wire bond and flip chip connections to Pb-free bumping and wafer level packaging and now to through silicon vias and interposers.
“Previously, companies in incremental steps of the supply chain could develop products relatively independently,” he notes. “Now they must work together to create solutions, or fail their common customers. Although the shortest path to market may be for the foundry to do everything in-house, the path to the best solutions that will enable competitive costs and high volume adaption will be flexible supply chains with collaborative partnering, flexibility, and transparency.”
Prior to GLOBALFOUNDRIES, David worked at Amkor Technology for 11 years, most recently leading the BGA, Flip Chip and MEMS product groups. He was responsible for extensions of package technology, bump, applications, and business performance. Prior to this, Dave was responsible for the fcBGA and fcCSP business group at Amkor. He led cross-functional teams in various areas including networking product strategy, mobile product development, large die/lead free flip chip development, and wafer level product strategy. David worked closely with Amkor factories in Asia.
Prior to Amkor, David worked at Biotronik, GmbH in Portland, OR. Biotronik is a developer and manufacturer of implanted medical devices including defibrillators and pacemakers. David worked at Biotronik for 9 years and had various roles in Production, Process Engineering, Product Engineering, and Flip Chip implementation. His last role at Biotronik was leading the assembly, interconnect, and product transition from wire bond to flip chip.
David has supported the Electronic Component and Technology Conference for more than 10 years. This year he is Conference General Chair.
Read McCann’s comments on ECTC is our report, ECTC: Focus on 3D integration and TSVs.
Register now for the free webcast: 3D and 2.5D Integration: A Status Report.