January 31, 2012 — The Thick Film Division of Heraeus Precious Metals has announced a new name, Celcion, for its Insulated Aluminum Materials System. Celcion allows light emitting diode (LED) circuits to run cooler than metal-core printed circuit boards (MCPCBs).
Celcion, a Thick Film Materials System designed to insulate aluminum substrates, takes the same fit and form as traditional MCPCBs, while providing thermal conductivity and high dielectric breakdown strength. It is a simplified additive process that is faster, easier to use, and requires less materials than MCPCBs. The system allows circuits to be built directly onto aluminum substrates, eliminating the need for thermal interface materials (TIMs). This allows Celcion circuits to run 10°C cooler than MCPCBs.
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Traditionally, MCPCBs are constructed using a subtractive process. Celcion features a selective additive process, applying material only where it is needed. It is reportedly faster with less waste, and enables inexpensive, fast-implementation design changes.
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| Figure. Actual thermal reading of LED circuits. Celcion-packaged LED reading is on the bottom. SOURCE: Heraeus. |
With cooler circuits, fewer LEDs can be used to achieve the same light output. This suits high-power applications, such as general illumination, signs, signals and displays. It also offers increased performance benefits in power electronics, heaters and automotive manufacturing.
Heraeus will feature Celcion at Booth 508 during the Strategies in Light 2012 conference and exhibition, Feb. 7 – 9, Santa Clara, CA, Booth 508. Through live, on-site product demonstrations, Heraeus will show how Celcion is used in manufacturing LEDs, and why it is a viable alternative to traditional MCPCBs.
Heraeus launched a website, http://celcionled.com/, to showcase the Insulated Aluminum Materials System. A video on the site describes the differences between the traditional MCPCB process and Celcion, and how LED performance is increased.
Heraeus Precious Metals North America Conshohocken LLC, Thick Film Division, is a worldwide supplier of thick film pastes, LTCC materials and precious metal powders to the hybrid microelectronics industry. The Thick Film Division offers products for thermal management applications, including LED packaging, power modules, and electronic heating units.