February 14, 2012 — Lita Shon-Roy, senior managing partner, Techcet Group and Michael Fury, PhD, director of market development at Vantage Technology Corporation/Techcet and regular ElectroIQ blogger, will present "CMP Market Outlook & New Technology – Dynamic Slurry Metrology," a free webinar at 2 times on February 22, for US/Europe and Asia attendees.
Chemical mechanical planarization (CMP) consumables continue to outpace other electronics assembly materials in year-over-year growth. The market now totals $1.65 billion. Wafer sensitivity to scratching during the CMP process has increased, negatively impacting yields and requiring significant process improvements. One possible methodology to increase yields is continuous, real-time monitoring of particle counts in CMP slurry. Also read: CMP metrics improved by undiluted slurry data
The webinar will cover:
- Trends in CMP technology development
- Recent activity in CMP consumables supply chains
- Preview of the 2012 CMP consumables market outlook
- New metrology for continuous monitoring of undiluted slurry
- Experimental results correlating real-time particle counts with scratches
Two sessions are available for US/Europe and for Asia:
Wednesday, February 22, 2012 9-10AM PST
REGISTER: https://www4.gotomeeting.com/register/613362631
and 7-8PM PST REGISTER: https://www4.gotomeeting.com/register/726615639
Visit Techcet Group’s website to learn more: http://techcet.com/