April 4, 2012 — The Georgia Institute of Technology (Georgia Tech) Packaging Research Center (PRC) and its industry partners are developing low-cost/high-I/O silicon and glass interposers. Current work covers ultra-thin interposers, via linings, roll-to-roll manufacturing, and more. More areas of focus will be added with a Thinfilm Passive Components (TPC) industry consortium.
GT PRC proposes to add four new focus areas that include:
- Second-level reliability with low CTE interposers;
- Ultra-fine-pitch interconnection, down to 15um pitch;
- Thermal enhancement of glass and silicon interposers and packages; and
- Thinfilm Passive planar or IPD integration enhanced by through vias in glass or silicon.
The primary objective of the passive consortium is to transform today’s thick and bulky discrete components into thin IPDs or thin planar films with 10X improvements in volumetric density and performance at the same cost as today’s components for power, digital, RF, and analog functions. The thin IPDs (see the figure) will be micro-assembled on, or deposited as planar thinfilms on silicon or glass interposers or packages.
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| Figure. High-performance thin-film passives on silicon and glass interposers. |
The TPC on Silicon and Glass Interposers and Packages Research focuses on:
Novel nanoscale materials and processes for improved properties such as volumetric density, stability and Quality factor
High-yield manufacturing with self-healing and precision-processing
Process integration as planar thin films or micro assembly of IPDs to silicon or glass substrates.
The Georgia Tech PRC has been pioneering low-cost and high I/O silicon and glass interposers with groundbreaking accomplishments in ultra-thin glass and Si panel handling, high throughput vias at small pitch, via-lining for electrical and thermo-mechanical performance, low-cost RDL, small-pitch Cu-to-Cu Interconnections, roll-to-roll ultra-thin glass, via reliability, electrical superiority of glass over Si, and prototype interposer demonstration. Companies interested in more information about this industry consortium are encouraged to contact Dr. Raj Pulugurtha at [email protected], or Prof. Rao Tummala at [email protected]. Internet: http://www.prc.gatech.edu/partnership/TPC.