SMD-0.5 Package

The SMD-0.5 package is said to have two times the power-handling capability as the 18-pin leadless chip carrier. Designed to accommodate up to a die size 3, the newproduct reportedly can be used with any RAD-Hard MOSFET, HEXFRED diodes, Schottky or standard HEXFET power MOSFET device. This compact surface mount package comes in at 1.0 g and dimensions of 0.296 x 0.400 x 0.115 in.

International Rectifier

El Segundo, Calif.

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