Wafer Bump Reflow System

The new multi-belt continuous conduction wafer bump reflow system provides highly controlled and repeatable reflow profiles. Wafers are heated by conduction from a conveyor belt in the heating zones with subsequent transfer to an independent cool belt in the cooling zones. This low particulate environment can maintain an atmosphere at less than 5 ppm 02.

Radiant Technology Corporation

Fullerton, Calif.

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