Water-soluble Solder Paste

The water-soluble R560 solder paste was designed to reduce voiding in BGA solder connections. It will not break down under high or low humidity conditions, and it demonstrates repeatable performance regardless of changes in the printing environment. The product has a shelf life of one month (at room temperature) and is compatible with enclosed print head systems.

Kester Solder

Des Plaines, Ill.

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