(August 6, 2009) BEAVERTON, OR — Maxtek Components Corporation, a Tektronix Inc. company and a provider of turnkey packaging services for microelectronics, introduced Rapid Prototyping Services. The new services are designed to support the need for faster validation of IC and package designs and speed the transition to full production.
For equipment manufacturers in the defense, measurement, medical, and communications industries, custom integrated circuits (ICs) are a frequent and critical part of their next-generation products just as timely delivery for these systems is vital to remaining competitive. With this growing time-to-market pressure, being able to reduce the time it takes to validate IC and package designs and move into the prototype phase of a project is increasingly valuable to system manufacturers and their development programs.
Maxtek’s Rapid Prototyping Services were developed to address this need for prototype speed, offering customers a path to rapidly validate their ASIC designs by providing access to advanced interconnect capabilities and a low-cost means of identifying issues. Maxtek provides access to an engineering team as well as a complete manufacturing line capable of supporting full-rate production of low-volume (1,000 to 100,000 parts per year) for high-performance or high-reliability IC packages and modules.
In evaluating the varying requirements of customers within the medical, communications, defense, and measurement markets, Maxtek identified three services levels for rapid prototyping: BGA Build-to-Print, Advanced Build-to-Print, and Process Evaluation Build. The levels are primarily based on device complexity and the associated resource requirements and lead-time.
Entry-level prototyping (the least complex) is offered via Maxtek’s BGA Build-to-Print service, assembling JEDEC-standard ball grid arrays (BGAs) in as little as three business days. For more complex packaging needs that may require additional production time, Maxtek created the Advanced Build-to-Print and Process Evaluation Build service levels to provide additional solutions and flexibility for custom requirements.
Maxtek, a Tektronix company, provides turnkey IC packaging and microelectronic module services to meet the demanding performance and reliability requirements of defense, medical, measurement and communications applications.For further information on Maxtek’s Rapid Prototyping Services, visit www.maxtek.com.