The International Electronics Manufacturing Initiative (iNEMI) is planning a two-day workshop to identify gaps and challenges related to organic substrate technology, scheduled for November 17-18 in Nagoya, Japan. The meeting will bring together leading original equipment manufacturers (OEMs), packaging firms and substrate providers to discuss technology requirements that must be addressed in order to facilitate continued miniaturization of electronics packaging.
“The packaging substrate provides significant potential for innovation but, at the same time, it is the most expensive component in advanced packages,” said Mario A. Bolanos, strategic packaging research and university collaborations manager for Texas Instruments and chair of the iNEMI Packaging Substrates Workshop. “Major innovations are needed to generate new disruptive technologies that willnot only close technology gaps but also push us to the next generation of organic substrates. Now is the time for industry-level action, and iNEMI is sponsoring this workshop to help build industry consensus on the critical gaps and identify opportunities to address them. The ultimate goal is to prevent organic substrate technology from becoming a limiting factor in the continued growth of electronics.”
Speakers
On day one, a series of speakers will discuss packaging-related topics such as next-generation product sector needs, assembly challenges, emerging packaging formats and more. On the second day, working teams will address key topics identified during the first day, and formulate potential industry action plans.
The agenda includes confirmed speakers from: Amkor, ASE, Cisco, EIT, IBIDEN, iNEMI, Intel, Kyocera, Nan Ya, Qualcomm, STATS ChipPAC, Texas Instruments and UMTC.
Registration Information
The registration fee is 250 USD for members, and 400 USD for non-members. Payment can be made by credit card or wire transfer. Registration closes November 1. For additional information, go to http://www.inemi.org/cms/calendar/Packaging_Substrates_Nov09.html
About iNEMI
The International Electronics Manufacturing Initiative’s mission is to identify and close technology gaps, which includes the development and integration of the electronics industry supply infrastructure. This industry-led consortium is made up of more than 65 manufacturers, suppliers, industry associations and consortia, government agencies and universities. iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government agencies, universities and other funding agencies to set priorities for future industry needs and R&D initiatives. iNEMI is based in Herndon, Virginia (near Washington, D.C.), with regional offices in Shanghai, China and Limerick, Ireland. For additional information about iNEMI, visit http://www.inemi.org.