High-performance BGA Socket

Ironwood Electronics introduces a high-performance BGA socket for 1.0mm pitch BGA 1156 pin ICs. The SG-BGA-6230 socket is designed for an 35X35 mm package size and operates at bandwidths up to 8 GHz with less than 1dB of insertion loss. The sockets are reportedly designed to dissipate up to several watts without extra heat sinking and can handle up to 100 watts with custom heat sink.

The contact resistance is typically 20 milliohms per pin. The socket connects all pins with 10 GHz bandwidth on all connections. It mounts on the target PCB with no soldering and minimal footprint. It is constructed to take the smallest board space possible and incorporates a new quick insertion method so that ICs can be changed out quickly.

The SG-BGA-6230 socket is constructed with high performance and low inductance elastomer contactor. The temperature range is -40 – +100&#deg;C. The pin self inductance is 0.11 nH and mutual inductance of 0.028 nH. Capacitance to ground is 0.028 pF. Current capacity is 5 amps per pin. Works with ICs such as ISSP90 1156 pin IC, 35X35mm with 34X34 array. Burnsville, MN www.ironwoodelectronics.com

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