The MetaPULSE thin film measurement tool from Rudolph Technologies is optimized specifically for copper via fill in 3D IC applications, as well as copper damascene processes at 45nm through 22nm technology nodes and copper via fill in 3D IC applications. Copper thickness and overburden measurements are critical in optimizing the CMP process that follows deposition during through-silicon via (TSV) manufacturing. The new tool measures reportedly can measure 60-80 product wafers/hour with gauge-capable precision and reduced cost of ownership.

Unlike optical and x-ray techniques, the MetaPULSE measures film thickness using a time-resolved acoustic signal that can be used in active die in the absence of special underlying test pads. The high-reliability, green wavelength ultrafast laser is optimized for copper applications, delivering higher signal-to-noise ratios and measurement repeatability better than 0.3% at throughputs of 60-80 product wafers/hour, supporting high-volume production. The system’s 10