The Applied Materials’ Charger UBM PVD system was designed for under-bump metallization (UBM), redistribution layer and CMOS image sensor applications. Its linear architecture is said to more than double the wafer output of other systems. In addition, its proprietary Isani wafer treatment technology allows the UBM system to process ten times more wafers between servicing.

Isani wafer treatment is said to minimizes defects on organic and high-stress films and extend process kit life by up to 10X, which lowers cost of consumables compared with traditional inductively coupled plasma sputter chambers. Select magnetron and PVD chamber design improvements fulfill exacting film deposition uniformity specifications for various metals used in UBM and RDL applications (e.g., Ti, TiW, Cu, and NiV).

The Charger system’s modular architecture features flexible configuration allowing for expansion from a compact three-chamber R&D configuration into a five-chamber, high-volume manufacturing system with minimal downtime. Applied Materials Santa Clara, CA; www.appliedmaterials.com