June 20, 2011 – Marketwire — Technic Inc. debuted Pallaspeed Pd/Ni NFA, a production-proven sulfate palladium nickel process that produces low-stress ductile deposits over a wide current density range, for structures like semiconductor package leadframes.

The Pallaspeed Pd/Ni NFA process eliminates free ammonia, improving worker and environmental safety (environment, health and safety, EHS) by preventing harmful fumes. The process is also chloride free, which helps maintain stainless steel equipment without corrosion. The pH of Pallaspeed Pd/Ni NFA is more stable than conventional Pd/Ni processes, reducing the need for frequent ammonia additions.

The Pallaspeed Pd/Ni NFA process produces micro-crack-free deposits at thicknesses up to 2.5um with excellent adhesion, according to Technic. The deposits pass both the hydrochloric and sulfurous acid porosity tests commonly used in the electronics industry.

This process is available globally under either the "NFA" designation in North America or the Pallaspeed Pd/Ni LA designation in Asia and Europe.

Technic Inc. supplies specialty chemicals, custom finishing equipment, engineered powders, and analytical control systems to electronic component, PCB, semiconductor, photovoltaic, and other industries. For information, go to www.technic.com

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