Robotic die bonder upgrades SET packaging platform

July 8, 2011 — SET – Smart Equipment Technology – will introduce the FC300R robotic device bonding platform at SEMICON West, July 12-14 in San Francisco, CA. The FC300R performs chip-to-substrate bonding, chip-to-wafer assembly, and chip-to-chip stacking for flip chip, through silicon via (TSV), and other advanced packaging processes.

The FC300R uses a loading robot added to the base of an FC300 bonding tool to increase component handling capabilities with substrates and waffle packs/GELPAKs, which the machine can store in large quantities. The tool accommodates components from 150 x 150

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