Henkel develops die attach film for leadframe packages

July 13, 2011 — Packaging materials supplier Henkel worked with STMicroelectronics (STM) to qualify Henkel’s Ablestik C100 conductive die attach film materials for production of very small package configurations in a process called ScalPack, which incorporates die with extremely small dimensions into leadframe packages.  

The die placement process was developed with Henkel to increase workability in leadframe packaging (over die attach pastes), said Laura Ceriati, STMicroelectronics corporate package development director for leaded package platforms. STMicro expects to use the conductive die attach tape for medium-power applications. With the Ablestik product, one leadframe design to be used for multiple package types.  

The 15 and 30

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