Fraunhofer’s Ramm will open International Wafer-Level Packaging Conference

(August 31, 2010) — Peter Ramm, Fraunhofer EMFT, will be the Opening Speaker at the 7th Annual International Wafer-Level Packaging Conference (IWLPC). The IWLPC will be held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, CA. Visit the events page here.

Ramm will present "The European 3D Technology Platform for Heterogeneous Systems" at the Kick-Off Reception on Tuesday, October 12 from 5:00-6:30pm. He will discuss the European 3D technology platform that has been established within the EC funded e-CUBES project, focusing on the requirements coming from heterogeneous systems.

Sponsored jointly by the SMTA and Chip Scale Review magazine, the annual IWLPC explores cutting-edge topics in wafer-level packaging (WLP) and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages. The event is sponsored by Amkor Technology, EV Group, NEXX Systems, Pac Tech USA, and Technic Inc.

Visit http://www.iwlpc.com for more information.

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