(December 6, 2010) — ALLVIA, through-silicon via (TSV) foundry, will present its latest analysis on silicon interposers and embedded capacitors during the 3D Architectures for Semiconductor Integration and Packaging Forum in Burlingame, CA, December 9-11. Dr. Nagesh Vodrahalli, vice president of technology and manufacturing at ALLVIA, will present a discussion on December 9 titled "Silicon Interposers with TSVs and Embedded Capacitors for Advanced Logic Applications."
His discussion will address:
- Drivers and status: VLSI packaging and 3D technologies
- Silicon interposer as the next logical step in the evolution of VLSI packaging
- Implementation of silicon interposers with embedded capacitors
ALLVIA offers services for prototyping and full volume production of both front side and back side TSVs and have integrated embedded capacitors on silicon interposers, a key interface between a silicon device and an organic substrate needed for managing high interconnect densities. Capacitance values higher than 1,500 nF/cm2 have been achieved for the embedded capacitors developed for delivering power to the devices. 3D integration with ALLVIA’s through-silicon via technology allows much closer access to high value capacitors than previously possible, leading to a much higher level of electrical performance.
3D Integration & Packaging Conference will be held at the Hyatt Regency San Francisco Airport Hotel in Burlingame, California, Dec. 8-10, 2010. See http://techventure.rti.org/
ALLVIA is a through-silicon via (TSV) foundry for prototyping and full volume production of both front side and back side TSVs to the MEMS and semiconductor industries as well as silicon etching, copper plating, photolithography, CMP, etc. For more information, visit www.allvia.com