(July 12, 2010) — Unisem Advanced Technologies (UAT) is expanding wafer bumping capacity in its factory in Ipoh, Malaysia. The bumping facility’s floor space will be increased by 100% and the increased capacity will be three times that of UAT’s current bumping capacity.

The new floor space’s clean room has been completed and installation of some of the new bumping equipment started in June. UAT expects the equipment that will provide this new additional capacity to be in place and available to customers beginning this September.

“We have seen tremendous demand from our customers for wafer bumping during the current industry upturn,” stated C.H. Ang, group COO of the Unisem Group. “In order to meet the growing needs of our customers, we are moving quickly to increase our floor space and capacity for bumping at UAT,” continued Ang.

UAT is a 3-party joint venture between Unisem, Advanpack Solutions and FlipChip International, and offers gold bumps, copper pillar bumps and solder bumps (through ball drop, plating and solder paste printing). Additionally, UAT provides repassivation and bond pad redistribution services. Unisem is a global provider of semiconductor assembly and test services for many of the world’s most successful electronics companies. Unisem offers an integrated suite of packaging and test services such as wafer bumping, wafer probing, wafer grinding, a wide range of leadframe and substrate IC packaging, wafer level CSP and RF, analog, digital and mixed-signal test services. For more information about Unisem, please visit www.unisemgroup.com.