Insights from SEMICON: Video interview with blogger Phil Garrou

(July 28, 2010) — In this video interview, Philip Garrou, microelectronics consultant and Advanced Packaging blogger, offers information on his blog, Insights from the leading edge, and summarizes reasonable roadmaps for 3D technology and TSV in particular. 2012 mainstream adoption seems too aggressive to Garrou.

Read Garrou’s blog, Insights from the Leading Edge

Recent post:

CMP, CMC and MOSIS have announced a multiproject wafer run for Jan 2011. MOSIS has been known for years as a supplier of prototype IC runs …

>> Read the Blog

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.