Kyocera room-temp epoxy molding compound competes with frozen semiconductor package encapsulants

July 18, 2012 – BUSINESS WIRE — Kyocera Industrial Ceramics Corporation, Chemical Sales Division introduced the environmentally friendly XKE-G5633 Epoxy Molding Compound (EMC).

The room-temperature product encapsulates ball-grid array (BGA) and land-grid array (LGA) semiconductor packages, with encapsulation quality and connectivity to match compounds that must be stored in a frozen state.

The room-temperature state of Kyocera

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

2 thoughts on “Kyocera room-temp epoxy molding compound competes with frozen semiconductor package encapsulants”

  1. Sunil Bali

    Please suggest some epoxy grade of Kyocera
    Diesel Resistant
    Having Good bonding with Metal & Plastic Both
    Can withstand -40degree centigrade to 120degree Centigrade without cracking

  2. Sunil Bali

    Please suggest some epoxy grade of Kyocera Diesel Resistant
    Having Good bonding with Metal & Plastic Both
    Can withstand -40degree centigrade to 120degree Centigrade without cracking.

    We urgently need your contact in India for Epoxy Procurement

Comments are closed.