CSCD WLCSP HVM test probe card retains pin, scales from x1 to x8

May 6, 2011 – Marketwire — Cascade Microtech, Inc. (NASDAQ: CSCD), wafer-level test & measurement provider, launched the Viper probe card series. Viper probe cards will be used for test of high-volume production wafer-level chip-scale packages (WLCSP). Viper’s probe pin is integrated into Cascade Microtech’s proprietary laminated housing for consistently good electrical results.

Users can easily scale from x1 to x8 and beyond on a per-die basis as production ramps, without changes to the layout of the multi-site probe card. Unlike traditional spring pin solutions, the Viper architecture features patented housing that ensures the pin is retained, maintaining tip position accuracy for consistent contact resistance and low inductance. The patented non-rotating pin reduces PCB pad wear, delivering a longer probe card lifetime.

Individual contact engines are replaceable on a per-DUT basis, requiring no special tools or microscopes. The Viper probe head can also be configured with the ‘Accel’ option, which allows for individual die testing, shortening test program development and enabling re-test of individual die. Also read: Accel-RF debuts reconfigurable RF test fixture

In smart phones, combo chips provide Bluetooth, WLAN, near-field communication and digital TV functionality. Combo chips predominantly use chip-scale and WLCSP packaging techniques, which demand high-performance known good die (KGD) testing.

WLCSP is the fastest-growing package style, and demand is outpacing the available market capacity. According to Yole Developpement, WLCSP accounts for more than 6% of all IC packages worldwide, and growth is expected to reach 15-20% within the next decade. The WLCSP market is dominated by optical, analog, and RF wafer-level package applications. IC manufacturers need cost-effective production strategies that ensure the highest quality, and to keep pace with demand to reduce the total test cost of ownership.

Cascade Microtech, Inc. (NASDAQ: CSCD) makes tools for precise electrical and mechanical measurement and test of integrated circuits (ICs) and other small structures. Cascade Microtech’s semiconductor production test products include unique probe cards and test sockets that reduce manufacturing costs of high-speed and high-density semiconductor chips. For more information visit www.cascademicrotech.com.

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.