May 31 2011 — RJR Polymers, high-performance air cavity package (ACP) developer, will debut liquid crystal polymer (LCP) semiconductor packaging technology for RF and microwave system designers at the International Microwave Symposium (IMS2011). RJR’s new product is competitive with ceramic ACPs, improving thermal management and offering design flexibility based on the company’s epoxy range. 

The company is currently offering two thermally-enhanced, metal-based ACP platforms for radio frequency (RF) power and quad flat-pack no-lead (QFN) applications.

Designers can use copper or various other metal bases in the new package, selecting RJR’s epoxies and epoxy-coated lids to meet design-specific requirements. Thermally efficient power transistor packages need to handle higher-performance devices now, said Wil Salhuana, president and CEO, RJR, noting that designers still require flexibility for their systems.

The three-piece package can include materials with high thermal conductivity and components with higher co-efficient of thermal expansion (CTE) mismatch. The modular product line uses a standard molding process and creates a flat seal surface. RJR says this manufacturing technique creates one-third the dielectric found in ceramic and copper leads. By creating a single injection mold and simply swapping out the lead frame, LCP ACP users can use the same package for diverse products with lower design overhead and development time than creating new packages for each iteration.  The packaging technology can be built to all industry standard configurations or modified for custom designs.

RJR will be available to discuss this innovative packaging technology at IMS2011 in booth 718. The IEEE Microwave Theory and Techniques Society (MTT-S) International Microwave Symposium covers all of the latest developments in microwave technology from nano devices to systems applications, June 5-10 in Baltimore, MD.

RJR Polymers, Inc. develops air cavity LCP semiconductor packaging, epoxies, epoxy-coated lids and sealing equipment for RF, cellular, automotive, optical, imaging, and sensor applications, as well as new solar power, high-power LED, and highly integrated system-level applications. For more information, visit www.rjrpolymers.com.

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