December 27, 2011 — The Global Semiconductor Alliance (GSA) released "3D IC Architecture: A Natural Evolution," a report sponsored by Macronix International Co. Ltd. and Etron Technology Inc. GSA also published the second edition of the 3D IC Design Tools and Services Tour Guide.
3D IC Architecture covers 3D and 2.5D packaging technology: benefits, gaps in the current semiconductor ecosystem, barriers, applications, and ways to accelerate commercialization.
The Tour Guide compiles input from EDA, R&D, market research and services companies involved in the commercialization of 3D and 2.5D interconnect technology. The Tour Guide documents the 3D IC capabilities of these companies.
Also read: GSA awards semiconductor companies
"GSA provides a forum for key players in this complex semiconductor ecosystem and recognizes the need to support design and manufacturing standards as well as new business practices to accelerate 2.5D and 3D market adoption," said Jodi Shelton, president of GSA.
GSA also hosts forums on the packaging technologies, working group meetings, and other events. The Alliance also publishes articles on packaging trends. To participate in this important effort, please contact Wade Giles at http://www.gsaglobal.org/association/contact_form_wade.aspx.
The Report and Tour Guide are complimentary to GSA members and available for download at http://www.gsaglobal.org/publications/3dic/index.asp. Non-members may purchase the Report and Tour Guide through the GSA Store.
The Global Semiconductor Alliance mission is to accelerate the growth and increase the return on invested capital of the global semiconductor industry by fostering a more effective ecosystem through collaboration, integration and innovation. Internet: www.gsaglobal.org.
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