December 1, 2011 – BUSINESS WIRE — Power management semiconductor maker International Rectifier (IR, NY:IRF) purchased multiple Apollo physical vapor deposition (PVD) systems from packaging equipment maker NEXX Systems for its Newport, Wales fab.

The Apollo’s backside metallization capabilities will be used to make next-generation power devices, including insulated gate bipolar transistors (IGBTs).

The Apollo can handle extremely thin wafers and permits wafer size conversions during production, in under an hour. Apollo’s Bernoulli wafer handling system moves thinned wafers on a processing tray in an atmospheric environment, handling thin wafers, bowed wafers, and several distinctive wafer shapes in high-temperature anneal processing.

IR qualified and ordered Apollo PVD systems because they enable cutting-edge advanced packaging technologies unavailable in the marketplace, said Alain Charles, VP of technology development at IR.

International Rectifier makes power management technology: analog and mixed signal ICs, advanced circuit devices, integrated power systems and components. Additional information can be found at www.irf.com.

NEXX Systems makes equipment for flip chip and advanced packaging: Apollo and Stratus, for high throughput deposition of metals. Learn more at www.nexxsystems.com.

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