TEL power chip dynamicing occurs at the wafer level

December 6, 2011 — Tokyo Electron Limited (TEL) has successfully demonstrated dynamicing — device switching/dynamic characteristic (AC) — of a power device at the wafer level, which previous only took place after semiconductor assembly and packaging.

TEL developed the dynamicing technique based on Tokyo Electron’s experience in wafer probe technology. By detecting defects at the wafer-level, TEL’s method ensures that known-good die (KGD) are used in multi-die power devices, which provide higher electrical efficiency and performance than traditional designs.

Until now, only staticing — device static characteristic (DC) — has been performed at the wafer level, TEL reports.

Tokyo Electron Limited (TEL) manufactures semiconductor and FPD production equipment, including plasma and ion etchers, and deposition systems. Learn more at www.tel.com.

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