MX’s RDL, copper wire bonding processes take aim at packaging costs

December 12, 2011 – PRNewswire via COMTEX — MagnaChip Semiconductor Corporation (NYSE:MX), designer and manufacturer of analog and mixed signal semiconductor products, now offers a redistribution layer (RDL) metal process for wafer bumping and an I/O structure and process that is fully compatible with copper wire bonding, reducing packaging costs.

RDL packaging moves wire bond pads around the die perimeter to bump pads in the die center, allowing for larger pitches at wafer bumping and solder use rather than plating. This process requires one additional aluminum layer and is fully compatible with MagnaChip’s standard CMOS process.

Working with major packaging providers (MagnaChip named Amkor as one example), the company developed a copper wire bonding process that avoids dielectric cracks beneath pads caused by higher mechanical stresses. Copper wire bonding will save materials costs and increase conductivity over gold wire bonding.

MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high-volume consumer applications. For more information, please visit www.magnachip.com.

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