November 2, 2011 — Henkel Corporation will launch several new electronics assembly materials at Productronica, November 15-18 in Munich, Germany. The new HYSOL underfill is a halogen free, reworkable epoxy capillary underfill with a high glass transition temperature (Tg).
The material is designed for chipscale packages (CSP) and ball grid array (BGA) devices and is particularly well suited for handheld communication and entertainment applications. This high Tg underfill also provides enhanced thermal cycling performance for small pitch wafer level chip scale packages (WLCSPs) unattainable with other low Tg reworkable underfills.
It cures quickly at moderate temperatures to minimize stress to other components and, when cured, provides excellent mechanical stress protection for solder joints.
The unique formulation offers superb reworkability while maintaining excellent drop and thermal cycling protection.
The underfill, as well as lead-free solders and new electrically conductive adhesives, among others, will debut on stand 263 in hall 4 of Productronica.
Henkel operates in three business areas: Laundry & Home Care, Cosmetics/Toiletries and Adhesive Technologies. Henkel